Biography

Education

• 2014 - 2017: Ph.D., University of Cambridge, U.K. 

• 2011 - 2012: M.Sc. (with distinction), Imperial College London, U.K.

• 2008 - 2011: B.Sc. (with First Class Honor), Université Pierre et Marie Curie (UPMC), or University Paris VI, or Sorbonne University, Paris, France. 

Experiences

• 12/2020 - present: Assistant Professor, Delft University of Technology, The Netherlands. 

• 04/2018 - 11/2020: Postdoctoral Researcher, University of California, Berkeley, CA, U.S.A. 

• 12/2017 - 03/2018: Visiting scholar at Fudan University. 

• 2013 - 2014: Senior digital IC engineer and department vice-director, Shanghai, China.

• 2012 - 2013: Research assistant, Université Pierre et Marie Curie (UPMC), Paris, France. 

Biography

Sijun Du received a B.Sc. degree (Hons.) in Electronic Engineering from Pierre and Marie Curie University (UPMC), Paris, France, in 2011, and an M.Sc. degree (distinction) in Electrical & Electronic Engineering from Imperial College London, UK, in 2012. From 2012 to 2014, he was a digital IC design engineer in Shanghai, China. In October 2014, he became a Ph.D. candidate at the University of Cambridge, UK, where he received his Ph.D. degree in 2017. After his Ph.D., he joined the University of California at Berkeley as a postdoctoral researcher. Sijun will join TU Delft as an assistant professor (tenure-track) in Dec 2020. 

In the entire four years of Sijun's undergraduate and postgraduate study periods, he was ranked First in the department for each semester. After he joined the University of Cambridge for a Ph.D., he spent less than three years finishing his research and thesis (normally four years are required). Based on his Ph.D. research, he published more than 40 journal & conference papers and 3 US patents, including several first-authored publications in the top journal (IEEE JSSC) and top conference (ISSCC) in the Integrated Circuits Industry. His ISSCC paper is the first ever ISSCC paper from the University of Cambridge. 

His research interests include energy-efficient circuits and systems, energy harvesting, wireless power transfer, power management ICs, low-power analog/digital signal processing and low-power communications used in autonomous sensors & sensing systems for the Internet of Things (IoT), wearable electronics, biomedical implants, and microrobots.